ЧП Ворон. Электронные компоненты и радиомонтажное оборудование. Микросхемы, транзисторы, реле, резисторы, конденсаторы, паяльное оборудование, припой.
Корзина пуста!
ВХОД ДЛЯ КЛИЕНТОВ

Забыли пароль?
Зарегистрироваться

УВАГА! Шановні клієнти магазину в м.Дніпро!

З 18.12.23 магазин в м.Дніпро за адресою вул.Новокримська 58 не працює.
Однак, наш інтернет-магазин відкритий для вас 24/7.
Усі місцеві замовлення можуть бути відправлені кур'єрськими службами.




Поиск:

Enter a search string or click on the microphone icon and begin speaking.

×
История запросов
ваша история поиска пуста
Whole catalog Materials for production and repairSoldering materials (solder, flux, braid)Soldering paste
Код товара:
018632

Solder paste P818-633-90-J5 Qualitek 818 Sn63/Pb37 type 3, 90% ROL0 [500 g]

Medium melting tin-lead solder paste with no-clean flux. Designed for reflow soldering of SMD elements. For production and repair. Sn67Pb37 alloy. Bank of 500 grams.
 Solder paste P818-633-90-J5  Qualitek 818 Sn63/Pb37 type 3, 90% ROL0 [500 g]
NOT available.
Expected price: 2 400,00 UAH
from 1 pc : 2 400,00 UAH
from 3 pcs : 2 352,00 UAH ( -2,0%)
from 10 pcs : 2 304,00 UAH ( -4,0%)
Prices are indicated at the time of product availability and may change upon receipt

Current balances:

NOT available

Изображение товара

Product description format_size zoom_out zoom_in

818 is a lead-based solder paste containing halogen-free no-clean flux (J-STD-004 type ROL0). After the soldering process, a minimum amount of transparent, non-corrosive, non-conductive flux residues remains on the PCB compared to conventional solder pastes.
The properties of the chemical formula of this paste provide excellent activity, long-term retention of adhesive properties to hold components on the printed circuit board.
 
Advantages:
  • Minimal amount of flux residues after the soldering process
  • Excellent activity
  • Retention of adhesive properties up to 48 hours
  • Stencil life up to 24 hours
  • High print speed up to 150mm/sec
  • Headspace method can be used for reflow
Alloy - Sn63 / Pb37
Particle size: 25-45 microns
Metal content of the paste: 89% 
 
 
Physical/chemical properties
  • Color/Appearance - Metallic Gray
  • Copper Mirror Test (for the corrosiveness of the flux) - Passes without violations
  • Silver chromate test - Passes without discoloration
Surface insulation resistance Ohm

  ROL0
J-STD-004  
Bellcore  


   
pH- 5% Aqueous solution 3.0 – 5.0
Softening point 125°C
 

Viscosity

Malcolm Method 1 140-200 kilopulse/sec, 90% metal, ( -325+500 mesh)
Brookfield Method 2 900kp/s +/- 10%, 90% metal, (-325+500 mesh)
 

 
Malcom PCU-Series, 10 RPM, 25°C
Brookfield RVTD, TF spindle, 5 RPM, 25°C, 0.75” spindle depth
Bellcore GR-78-CORE

Recommended reflow profile of solder paste:


 
Delta Elite® is a registered trademark of Qualitek International.


Shelf life
Closed can 2°-10°C - 12 months (according to experience of use - up to 18 months).
25°C - 1 month.
Recommended storage temperature: 2°-10°C.


Leave your feedback or ask a question

Only this product is discussed here. Off topic comments will be deleted! Please follow the Commenting Rules.

The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
To carry out technical calculations and obtain the exact parameters of the goods, use the datasheets from the manufacturer's website.

If you need additional information, or you found an error in the description, or have other questions about this product, then our manager will help you: Ярослав unknown