Small-sized chamber furnace for soldering electronic SMD components.
Heating chamber with pull-out tray, base size: 300 x 320 mm.
Typical thermal profiles for the most popular solder pastes.
Attention!A modified version of the stove is on sale, the software has been replaced. As a result of software replacement, thermostating is implemented according to the PID control algorithm (this also required a small hardware modification).
The thermal insulation of the chamber has also been improved, and assembly flaws have been eliminated.
The updated software also provides a clear actuation of the control buttons (anti-bounce), the menu interface has become much more convenient.
The display of the temperature profile of the thermal profile has become more detailed.
According to the reviews of customers who are already using "flashed" stoves, such a revision significantly affects the quality of the soldering.
Characteristics:
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heating chamber area: 300 x 320 cm
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overall dimensions of the furnace: 430 x 370 x 260 mm
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net weight: 12.5kg
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rated power: 1500 W
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supply voltage: AC110V ~ AC220V/50 ~ 60HZ
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technological cycle: 1 ~ 8 min
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oven packing size: 50 x 43 x33 cm
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gross weight: 14 kg
The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
